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Image: The chip sandwich: an electronics chip (the smaller chip on the top) integrated with a photonics chip, sitting atop a penny for scale. Photo Credit: Arian Hashemi Talkhooncheh |
Engineers at Caltech and the University of Southampton in England have collaboratively designed an electronics chip integrated with a photonics chip (which uses light to transfer data)—creating a cohesive final product capable of transmitting information at ultrahigh speed while generating minimal heat.
Though the two-chip sandwich is unlikely to find its way into your laptop, the new design could influence the future of data centers that manage very high volumes of data communication.
"Every time you are on a video call, stream a movie, or play an online video game, you're routing data back and forth through a data center to be processed," says Caltech graduate student Arian Hashemi Talkhooncheh (MS '16), lead author of a paper describing the two-chip innovation that was published in the IEEE Journal of Solid-State Circuits. "There are more than 2,700 data centers in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and out every second."
Just as your laptop heats up on your lap while you use it, the towers of servers in data centers that keep us all connected also heat up as they work, just at a much greater scale. Some data centers are even built underwater to cool the whole facility more easily. The more efficient they can be made, the less heat they will generate, and ultimately, the greater the volume of information that they will be able to manage.